MP4303 2002-11-20 1 toshiba power transistor module silicon npn epitaxial type (darlington power transistor 4 in 1) MP4303 high power switching applications. hammer drive, pulse motor drive and inductive load switching. small package by full molding (sip 12 pin) high collector power dissipation (4 devices operation) : p t = 4.4 w (ta = 25c) high collector current: i c (dc) = 2 a (max) high dc current gain: h fe = 2000 (min) (v ce = 2 v, i c = 1 a) maximum ratings (ta = 25c) characteristics symbol rating unit collector-base voltage v cbo 120 v collector-emitter voltage v ceo 100 v emitter-base voltage v ebo 6 v dc i c 2 collector current pulse i cp 4 a continuous base current i b 0.5 a collector power dissipation (1 device operation) p c 2.2 w collector power dissipation (4 devices operation) p t 4.4 w junction temperature t j 150 c storage temperature range t stg ? 55 to 150 c array configuration industrial applications unit: mm jedec D jeita D toshiba 2-32c1b weight: 3.9 g (typ.) 1 r1 r2 7 r1 4.5 k ? r2 300 ? 6 12 8 5 2 3 10 49 11
MP4303 2002-11-20 2 thermal characteristics characteristics symbol max unit thermal resistance of junction to ambient (4 devices operation, ta = 25c) r th (j-a) 28.4 c/w maximum lead temperature for soldering purposes (3.2 mm from case for 10 s) t l 260 c electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit collector cut-off current i cbo v cb = 120 v, i e = 0 a D D 10 a collector cut-off current i ceo v ce = 100 v, i b = 0 a D D 10 a emitter cut-off current i ebo v eb = 6 v, i c = 0 a 0.5 D 2.5 ma collector-base breakdown voltage v (br) cbo i c = 1 ma, i e = 0 a 120 D D v collector-emitter breakdown voltage v (br) ceo i c = 10 ma, i b = 0 a 100 D D v h fe (1) v ce = 2 v, i c = 1 a 2000 D 15000 dc current gain h fe (2) v ce = 2 v, i c = 2 a 1000 D D D collector-emitter v ce (sat) i c = 1 a, i b = 1 ma D D 1.5 saturation voltage base-emitter v be (sat) i c = 1 a, i b = 1 ma D D 2.0 v transition frequency f t v ce = 2 v, i c = 0.5 a D 100 D mhz collector output capacitance c ob v cb = 10 v, i e = 0 a, f = 1 mhz D 20 D pf turn-on time t on D 0.4 D storage time t stg D 4.0 D switching time fall time t f i b1 = ? i b2 = 1 ma, duty cycle 1% D 0.6 D s emitter-collector diode ratings and characteristics (ta = 25c) characteristics symbol test condition min typ. max unit maximum forward current i fm D D D 2 a surge current i fsm t = 1 s, 1 shot D D 4 a forward voltage v f i f = 0.5 a, i b = 0 a D D 2.0 v reverse recovery time t rr D 1.0 D s reverse recovery charge q rr i f = 2 a, v be = ? 3 v, di f /dt = ? 50 a/s D 5 D c i b1 20 s v cc = 30 v output 30 ? i b2 i b1 input i b2
MP4303 2002-11-20 3 flyback-diode rating and characteristics (ta = 25c) characteristics symbol test condition min typ. max unit maximum forward current i fm D D D 2 a reverse current i r v r = 120 v D D 0.4 a reverse voltage v r i r = 100 a 120 D D v forward voltage v f i f = 0.5 a D D 1.8 v
MP4303 2002-11-20 4 collector current i c (a) v ce (sat) ? i c collector-emitter saturation voltage v ce (sat) (v) collector current i c (a) v be (sat) ? i c base-emitter saturation voltage v be (sat) (v) 0.1 0.5 common emitter i c /i b = 500 0.3 0.5 1 3 5 1 3 5 10 25 100 ta = ? 55c 0.1 0.5 common emitter i c /i b = 500 0.3 0.5 1 3 5 1 3 5 10 25 100 ta = ? 55c collector current i c (a) h fe ? i c dc current gain h fe base current i b (ma) v ce ? i b collector-emitter voltage v ce (v) collector-emitter voltage v ce (v) i c ? v ce collector current i c (a) base-emitter voltage v be (v) i c ? v be collector current i c (a) 0 0 1 2 3 4 1 2 3 4 5 common emitter v ce = 2 v 25 ? 55 ta = 100c 100 0.03 25 ? 55 tc = 100c 0.1 0.3 1 3 10 300 500 1000 3000 5000 10000 common emitter v ce = 2 v 0 0 common emitter ta = 25c 1 2 3 4 2 4 6 8 10 4 2 1 0.4 i b = 0.15 ma 0.2 0.3 0.5 0 common emitter ta = 25c 0 0.1 0.3 1 3 10 30 100 300 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 1.5 i c = 4 a 3 2 1 0.5 0.1 500
MP4303 2002-11-20 5 0 0 circuit board a ttached on a circuit board (1) 1 device operation (2) 2 devices operation (3) 3 devices operation (4) 4 devices operation 40 80 120 160 200 1 2 3 4 5 (4) (2) (1) (3) collector-emitter voltage v ce (v) safe operating area collector current i c (a) pulse width t w (s) ambient temperature ta (c) p t ? ta total power dissipation p t (w) total power dissipation p t (w) ? t j ? p t junction temperature increase ? t j (c) 0.01 1 3 5 10 30 50 100 300 0.03 0.05 0.1 0.3 0.5 1 3 5 10 *: single nonrepetitive pulse ta = 25c curves must be derated linearly with increase in temperature. i c max (pulsed)* 10 ms* 1 ms* 100 s* v ceo max r th ? t w transient thermal resistance r th (c/w) 0 0 attached on a circuit board (1) 1 device operation (2) 2 devices operation (3) 3 devices operation (4) 4 devices operation circuit board 2 4 6 8 10 40 80 120 160 200 (4) (2) (1) (3) 0.001 0.01 0.1 1 10 100 1000 curves should be applied in thermal limited area. (single nonrepetitive pulse) below figure show thermal resistance per 1 unit versus pulse width. (3) (2) (1) 1 3 10 30 100 300 (4) -no heat sink and attached on a circuit board- (1) 1 device operation (2) 2 devices operation (3) 3 devices operation (4) 4 devices operation circuit board
MP4303 2002-11-20 6 toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc.. the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others. the information contained herein is subject to change without notice. 000707ea a restrictions on product use
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